Non-leaded integrated circuit package system with multiple ground sites

ABSTRACT

A non-leaded integrated circuit package system includes: a die paddle of a lead frame; a dual row of terminals including an outer terminal and an inner terminal; and an inner terminal and an adjacent inner terminal to form a fused lead.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a divisional of co-pending U.S. patent application Ser. No.11/276,684 filed Mar. 10, 2006.

TECHNICAL FIELD

The present invention relates generally to integrated circuit packagesand more particularly to ground planes of integrated circuit packages.

BACKGROUND ART

Modern consumer electronics, such as cellular phones, digital cameras,and music players, are packing more integrated circuits into an evershrinking physical space with expectations for decreasing cost. Numeroustechnologies have been developed to meet these requirements. Some of theresearch and development strategies focus on new package technologieswhile others focus on improving the existing and mature packagetechnologies. Research and development in the existing packagetechnologies may take a myriad of different directions.

Consumer electronics requirements demand more integrated circuits in anintegrated circuit package while paradoxically providing less physicalspace in the system for the increased integrated circuits content.Continuous cost reduction is another requirement. Some technologiesprimarily focus on integrating more functions into each integratedcircuit. Other technologies focus on stacking these integrated circuitsinto a single package. While these approaches provide more functionswithin an integrated circuit, they do not fully address the requirementsfor lower height, smaller space, and cost reduction.

One proven way to reduce cost is to use mature package technologies withexisting manufacturing methods and equipments. Paradoxically, the reuseof existing manufacturing processes does not typically result in thereduction of package dimensions. As the integrated circuit contentincreases in a package, the input and output density increases. Theinput and output density increase also creates challenges for theprinted circuit board. The design of the printed circuit board increasesin complexity and congestion resulting from the increase in the inputand output density of the package.

Thus, a need still remains for a non-leaded integrated circuit packagesystem supporting higher input and output pin count while alleviatingthe demands on the printed circuit board designs. In view of theever-increasing need to save costs and improve efficiencies, it is moreand more critical that answers be found to these problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a non-leaded integrated circuit packagesystem including: a die paddle of a lead frame; a dual row of terminalsincluding an outer terminal and an inner terminal; and an inner terminaland an adjacent inner terminal to form a fused lead.

Certain embodiments of the invention have other aspects in addition toor in place of those mentioned or obvious from the above. The aspectswill become apparent to those skilled in the art from a reading of thefollowing detailed description when taken with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a non-leaded integrated circuit package systemin an embodiment of the present invention;

FIG. 2 is a plan view of a non-leaded integrated circuit package systemin an alternative embodiment of the present invention;

FIG. 3 is a plan view of a non-leaded integrated circuit package systemin another alternative embodiment of the present invention;

FIG. 4 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 5 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 6 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 7 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 8 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 9 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 10 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 11 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 12 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 13 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 14 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 15 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention;

FIG. 16 is a plan view of a non-leaded integrated circuit package systemin yet another alternative embodiment of the present invention; and

FIG. 17 is a flow chart of a non-leaded integrated circuit packagesystem for manufacturing the non-leaded integrated circuit packagesystem in an embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known system configurations, and process steps are not disclosed indetail. Likewise, the drawings showing embodiments of the apparatus aresemi-diagrammatic and not to scale and, particularly, some of thedimensions are for the clarity of presentation and are shown greatlyexaggerated in the figures. In addition, where multiple embodiments aredisclosed and described having some features in common, for clarity andease of illustration, description, and comprehension thereof, similarand like features one to another will ordinarily be described with likereference numerals.

The term “horizontal” as used herein is defined as a plane parallel tothe conventional integrated circuit surface, regardless of itsorientation. The term “vertical” refers to a direction perpendicular tothe horizontal as just defined. Terms, such as “on”, “above”, “below”,“bottom”, “top”, “side” (as in “sidewall”), “higher”, “lower”, “upper”,“over”, and “under”, are defined with respect to the horizontal plane.

The term “processing” as used herein includes deposition of material,patterning, exposure, development, etching, cleaning, molding, and/orremoval of the material or as required in forming a described structure.

Referring now to FIG. 1, therein is shown a plan view of a non-leadedintegrated circuit package system 100 in an embodiment of the presentinvention. The non-leaded integrated circuit package system 100 includesa die paddle 102 connected to tie bars 104. The die paddle 102 is withina dual row of terminal pads with an outer row having outer terminals 106and an inner row having inner terminals 108. The outer terminals 106 andthe inner terminals 108 are in a staggered configuration.

The non-leaded integrated circuit package system 100 also includes firstfused leads 110, such as two of the inner terminals 108 depopulated andfused, providing ground bonding pads for an integrated circuit die (notshown) attached to the die paddle 102. The first fused leads 110 have afused shape including regions of at least two of the inner terminals 108and regions between facing sides of the at least two of the innerterminals 108. The first fused leads 110 in a row are isolated from atleast another of the inner terminals 108 in the row. The first fusedleads 110 may be formed by a number of processes, such as etching thelead frame to fuse the leads configured by lead frame artwork design.

The first fused leads 110 surround the inner terminals 108 not fused aswell as surrounded by the inner terminals 108 not fused. The first fusedleads 110 are formed along a first side 112, a second side 114, a thirdside 116, and a fourth side 118 and have extensions 120 extending to theedges of the non-leaded integrated circuit package system 100 andsurrounding one of the outer terminals 106. For illustrative purpose,the first fused leads 110 are shown as depopulating two of the innerterminals 108, although it is understood the number of the innerterminals 108 depopulated may differ, as well.

The first fused leads 110 provide additional flexibility for groundtraces (not shown) of a printed circuit board (not shown) to provideground connection to the non-leaded integrated circuit package system100 reducing the routing congestion of the printed circuit board. Theadditional routing flexibility alleviates the need to use a larger pincount, larger footprint package allowing the non-leaded integratedcircuit package system 100 to be as small a footprint as possible.

The extensions 120 may provide ground shielding to the one of the outerterminals 106 surrounded by the extensions 120 without using the outerterminals 106 for the ground shielding and alleviating the need to routeground traces of the printed circuit for the ground shielding. Theextensions 120 enable maximum use of the outer terminals 106 fornon-ground functions resulting in a smaller package footprint.

An encapsulant 122 surrounds the die paddle 102, the tie bars 104, theouter terminals 106, the inner terminals 108, the first fused leads 110,and the extensions 120. The outer terminals 106 and the inner terminals108 are exposed for connections to the next system level (not shown),such as the printed circuit board. The die paddle 102 may be exposed forconnection to the next system level. The first fused leads 110 may beexposed for connections to the next system level. The extensions 120 maybe exposed for connections to the next system level.

Referring now to FIG. 2, therein is shown a plan view of a non-leadedintegrated circuit package system 200 in an alternative embodiment ofthe present invention. The non-leaded integrated circuit package system200 includes the die paddle 102 connected to the tie bars 104. The diepaddle 102 is within the dual row of the terminals pads with the outerrow having the outer terminals 106 and the inner row having the innerterminals 108. The outer terminals 106 and the inner terminals 108 arein a staggered configuration.

The non-leaded integrated circuit package system 200 also includes firstfused leads 202, such as two of the inner terminals 108 depopulated andfused, providing ground bonding pads for an integrated circuit die (notshown) attached to the die paddle 102. The first fused leads 202surround the inner terminals 108 not fused as well as surrounded by theinner terminals 108 not fused. The first fused leads 202 are formedalong the first side 112, the second side 114, the third side 116, andthe fourth side 118. For illustrative purpose, the first fused leads 202are shown as depopulating two of the inner terminals 108, although it isunderstood the number of the inner terminals 108 depopulated may differ,as well.

The first fused leads 202 provide additional flexibility for groundtraces (not shown) of a printed circuit board (not shown) to provideground connection to the non-leaded integrated circuit package system200 reducing the routing congestion of the printed circuit board. Theadditional routing flexibility alleviates the need to use a larger pincount, larger footprint package allowing the non-leaded integratedcircuit package system 200 to be as small a footprint as possible.

The encapsulant 122 surrounds the die paddle 102, the tie bars 104, theouter terminals 106, the inner terminals 108, and the first fused leads202. The outer terminals 106 and the inner terminals 108 are exposed forconnections to the next system level (not shown), such as the printedcircuit board. The die paddle 102 may be exposed for connection to thenext system level. The first fused leads 202 may be exposed forconnections to the next system level.

Referring now to FIG. 3, therein is shown a plan view of a non-leadedintegrated circuit package system 300 in another alternative embodimentof the present invention. The non-leaded integrated circuit packagesystem 300 includes the die paddle 102 connected to the tie bars 104,and paddle interconnects 302. The die paddle 102 is within the dual rowof the terminals pads with the outer row having the outer terminals 106and the inner row having the inner terminals 108. The outer terminals106 and the inner terminals 108 are in a staggered configuration.

The non-leaded integrated circuit package system 300 also includes firstfused leads 304, such as two of the inner terminals 108 depopulated andfused, providing ground bonding pads for an integrated circuit die (notshown) attached to the die paddle 102. The first fused leads 304surround the inner terminals 108 not fused as well as surrounded by theinner terminals 108 not fused. The first fused leads 304 are formedalong the first side 112, the second side 114, the third side 116, andthe fourth side 118 and have extensions 306 extending to the edges ofthe non-leaded integrated circuit package system 300 and surrounding oneof the outer terminals 106. For illustrative purpose, the first fusedleads 304 are shown as depopulating two of the inner terminals 108,although it is understood the number of the inner terminals 108depopulated may differ, as well.

The first fused leads 304 provide additional flexibility for groundtraces (not shown) of a printed circuit board (not shown) to provideground connection to the non-leaded integrated circuit package system300 reducing the routing congestion of the printed circuit board. Theadditional routing flexibility alleviates the need to use a larger pincount, larger footprint package allowing the non-leaded integratedcircuit package system 300 to be as small a footprint as possible.

The extensions 306 may provide ground shielding to the one of the outerterminals 106 surrounded by the extensions 306 without using the outerterminals 106 for the ground shielding and alleviating the need to routeground traces of the printed circuit for the ground shielding. Theextensions 306 enable maximum use of the outer terminals 106 fornon-ground functions resulting in a smaller package footprint.

Each of the first fused leads 304 have one of the paddle interconnects302 connecting the first fused leads 304 to the die paddle 102. Thepaddle interconnects 302 provide additional routing flexibility for theprinted circuit board design by providing the option for ground to beconnected to the die paddle 102 for the ground connection to the firstfused leads 304 and the extensions 306. The paddle interconnects 302also enable a smaller package footprint.

The encapsulant 122 surrounds the die paddle 102, the tie bars 104, theouter terminals 106, the inner terminals 108, the first fused leads 304,the extensions 306, and the paddle interconnects 302. The outerterminals 106 and the inner terminals 108 are exposed for connections tothe next system level (not shown), such as the printed circuit board.The die paddle 102 may be exposed for connection to the next systemlevel. The first fused leads 304 may be exposed for connections to thenext system level. The extensions 306 may be exposed for connections tothe next system level. The paddle interconnects 302 may be exposed forconnections to the next system level.

Referring now to FIG. 4, therein is shown a plan view of a non-leadedintegrated circuit package system 400 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 400 includes the die paddle 102 connected to the tie bars104, and paddle interconnects 402. The die paddle 102 is within the dualrow of the terminals pads with the outer row having the outer terminals106 and the inner row having the inner terminals 108. The outerterminals 106 and the inner terminals 108 are in a staggeredconfiguration.

The non-leaded integrated circuit package system 400 also includes firstfused leads 404, such as two of the inner terminals 108 depopulated andfused, providing ground bonding pads for an integrated circuit die (notshown) attached to the die paddle 102. The first fused leads 404surround the inner terminals 108 not fused as well as surrounded by theinner terminals 108 not fused. The first fused leads 404 are formedalong the first side 112, the second side 114, the third side 116, andthe fourth side 118. For illustrative purpose, the first fused leads 404are shown as depopulating two of the inner terminals 108, although it isunderstood the number of the inner terminals 108 depopulated may differ,as well.

The first fused leads 404 provide additional flexibility for groundtraces (not shown) of a printed circuit board (not shown) to provideground connection to the non-leaded integrated circuit package system400 reducing the routing congestion of the printed circuit board. Theadditional routing flexibility alleviates the need to use a larger pincount, larger footprint package allowing the non-leaded integratedcircuit package system 400 to be as small a footprint as possible.

Each of the first fused leads 404 have one of the paddle interconnects402 connecting the first fused leads 404 to the die paddle 102. Thepaddle interconnects 402 provide additional routing flexibility for theprinted circuit board design by providing the option for ground to beconnected to the die paddle 102 for the ground connection to the firstfused leads 404. The paddle interconnects 402 also enable a smallerpackage footprint.

The encapsulant 122 surrounds the die paddle 102, the tie bars 104, theouter terminals 106, the inner terminals 108, the first fused leads 404,and the paddle interconnects 402. The outer terminals 106 and the innerterminals 108 are exposed for connections to the next system level (notshown), such as the printed circuit board. The die paddle 102 may beexposed for connection to the next system level. The first fused leads404 may be exposed for connections to the next system level. The paddleinterconnects 402 may be exposed for connections to the next systemlevel.

Referring now to FIG. 5, therein is shown a plan view of a non-leadedintegrated circuit package system 500 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 500 includes the die paddle 102 connected to the tie bars104, and the first fused leads 110 having the extensions 120. The firstfused leads 110 and the extensions 120 connected to the first fusedleads 110 are on the first side 112 and the third side 116.

The non-leaded integrated circuit package system 500 also includessecond fused leads 502, such as six of the inner terminals 108depopulated and fused, and the extensions 120 extending from the secondfused leads 502. The extensions 120 connected to the second fused leads502 surround one and two of the outer terminals 106. The second fusedleads 502 and the extensions 120 connected to the second fused leads 502are on the second side 114 and the fourth side 118. The encapsulant 122surrounds the die paddle 102, the tie bars 104, the outer terminals 106,the inner terminals 108, the first fused leads 110, the second fusedleads 502, and the extensions 120.

For illustrative purpose, the extensions 120 are shown as surround oneor two of the outer terminals 106, although it is understood that theextensions may surround any number of the outer terminals 106 or one ofthe extensions 120 may be used, as well. Also for illustrative purpose,the second fused leads 502 are shown as depopulating six of the innerterminals 108, although it is understood the number of the innerterminals 108 depopulated may differ, as well.

Referring now to FIG. 6, therein is shown a plan view of a non-leadedintegrated circuit package system 600 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 600 includes the die paddle 102 connected to the tie bars104, the first fused leads 202, and the second fused leads 502. Thefirst fused leads 202 are on the first side 112 and the third side 116.The second fused leads 502 are on the second side 114 and the fourthside 118. The encapsulant 122 surrounds the die paddle 102, the tie bars104, the outer terminals 106, the inner terminals 108, the first fusedleads 202, and the second fused leads 502.

Referring now to FIG. 7, therein is shown a plan view of a non-leadedintegrated circuit package system 700 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 700 includes the die paddle 102 connected to the tie bars104 and the first fused leads 304 having the extensions 306. The firstfused leads 304 and the extensions 306 connected to the first fusedleads 304 are on the first side 112 and the third side 116. The secondfused leads 502 and the extensions 306 connected to the second fusedleads 502 are on the second side 114 and the fourth side 118. Paddleinterconnects 702 connect the first fused leads 304 and the second fusedleads 502 to the die paddle 102. The encapsulant 122 surrounds the diepaddle 102, the tie bars 104, the outer terminals 106, the innerterminals 108, the first fused leads 304, the second fused leads 502,the extensions 306, and the paddle interconnects 702.

Referring now to FIG. 8, therein is shown a plan view of a non-leadedintegrated circuit package system 800 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 800 includes the die paddle 102 connected to the tie bars104, and the first fused leads 404. The first fused leads 404 are on thefirst side 112 and the third side 116. The second fused leads 502 are onthe second side 114 and the fourth side 118. Paddle interconnects 802connect the first fused leads 404 and the second fused leads 502 to thedie paddle 102. The encapsulant 122 surrounds the die paddle 102, thetie bars 104, the outer terminals 106, the inner terminals 108, thefirst fused leads 404, the second fused leads 502, and the paddleinterconnects 802.

Referring now to FIG. 9, therein is shown a plan view of a non-leadedintegrated circuit package system 900 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 900 includes the die paddle 102 connected to the tie bars104, and the second fused leads 502 having the extensions 120. Thesecond fused leads 502 and the extensions 120 connected to the secondfused leads 502 are on the first side 112, the second side 114, thethird side 116 and the fourth side 118. The encapsulant 122 surroundsthe die paddle 102, the tie bars 104, the outer terminals 106, the innerterminals 108, the second fused leads 502, and the extensions 120.

Referring now to FIG. 10, therein is shown a plan view of a non-leadedintegrated circuit package system 1000 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 1000 includes the die paddle 102 connected to the tiebars 104, and the second fused leads 502. The second fused leads 502 areon the first side 112, the second side 114, the third side 116 and thefourth side 118. The encapsulant 122 surrounds the die paddle 102, thetie bars 104, the outer terminals 106, the inner terminals 108, and thesecond fused leads 502.

Referring now to FIG. 11, therein is shown a plan view of a non-leadedintegrated circuit package system 1100 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 1100 includes the die paddle 102 connected to the tiebars 104, and the second fused leads 502 having the extensions 120. Thesecond fused leads 502 and the extensions 120 connected to the secondfused leads 502 are on the first side 112, the second side 114, thethird side 116 and the fourth side 118. Paddle interconnects 1102connect the second fused leads 502 to the die paddle 102. Theencapsulant 122 surrounds the die paddle 102, the tie bars 104, theouter terminals 106, the inner terminals 108, the second fused leads502, the extensions 120, and the paddle interconnects 1102.

Referring now to FIG. 12, therein is shown a plan view of a non-leadedintegrated circuit package system 1200 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 1200 includes the die paddle 102 connected to the tiebars 104, and the second fused leads 502. The second fused leads 502 areon the first side 112, the second side 114, the third side 116 and thefourth side 118. Paddle interconnects 1202 connect the second fusedleads 502 to the die paddle 102. The encapsulant 122 surrounds the diepaddle 102, the tie bars 104, the outer terminals 106, the innerterminals 108, the second fused leads 502, and the paddle interconnects1202.

Referring now to FIG. 13, therein is shown a plan view of a non-leadedintegrated circuit package system 1300 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 1300 includes the die paddle 102 connected to the tiebars 104, and third fused leads 1302, such as two of the inner terminals108 closest to and adjacent to the tie bars 104. The extensions 120extend from the third fused leads 1302 to the edges of the non-leadedintegrated circuit package system 1300 and surround one of the outerterminals 106. The encapsulant 122 surrounds the die paddle 102, the tiebars 104, the outer terminals 106, the inner terminals 108, the thirdfused leads 1302, and the extensions 120. For illustrative purpose, thethird fused leads 1302 is shown as two of the inner terminals 108depopulated and fused, although it is understood that the number of theinner terminals 108 depopulated and fused may differ, as well.

Referring now to FIG. 14, therein is shown a plan view of a non-leadedintegrated circuit package system 1400 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 1400 includes the die paddle 102 connected to the tiebars 104, and the third fused leads 1302, such as two of the innerterminals 108 closest to the tie bars 104. The encapsulant 122 surroundsthe die paddle 102, the tie bars 104, the outer terminals 106, the innerterminals 108, and the third fused leads 1302.

Referring now to FIG. 15, therein is shown a plan view of a non-leadedintegrated circuit package system 1500 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 1500 includes the die paddle 102 connected to the tiebars 104, and the third fused leads 1302, such as two of the innerterminals 108 closest to the tie bars 104. The extensions 120 extendfrom the third fused leads 1302 to the edges of the non-leadedintegrated circuit package system 1500 and surround one of the outerterminals 106. Paddle interconnects 1502 connect each of the third fusedleads 1302 and the die paddle 102. The encapsulant 122 surrounds the diepaddle 102, the tie bars 104, the outer terminals 106, the innerterminals 108, the third fused leads 1302, the extensions 120, and thepaddle interconnects 1502.

Referring now to FIG. 16, therein is shown a plan view of a non-leadedintegrated circuit package system 1600 in yet another alternativeembodiment of the present invention. The non-leaded integrated circuitpackage system 1600 includes the die paddle 102 connected to the tiebars 104, and the third fused leads 1302, such as two of the innerterminals 108 closest to the tie bars 104. Paddle interconnects 1602connect each of the third fused leads 1302 and the die paddle 102. Theencapsulant 122 surrounds the die paddle 102, the tie bars 104, theouter terminals 106, the inner terminals 108, the third fused leads1302, and the paddle interconnects 1602.

Referring now to FIG. 17, therein is shown a flow chart of a non-leadedintegrated circuit package system 1700 for manufacturing the non-leadedintegrated circuit package system 100 in an embodiment of the presentinvention. The system 1700 includes providing a die paddle of a leadframe in a block 1702; forming a dual row of terminals including anouter terminal and an inner terminal in a block 1704; and selectivelyfusing an inner terminal and an adjacent inner terminal to form a fusedlead in a block 1706.

It has been discovered that the present invention thus has numerousaspects.

It has been discovered that the selectively forming fused leads from theinner terminals, the extensions from the fused leads, and paddleinterconnects to the die paddle simplifies the design and improvesmanufacturing yield of the non-leaded integrated circuit package system.The design simplification and yield improvement also occurs to theprinted circuit board that the non-leaded integrated circuit packagesystem is mounted thereon.

An aspect is that the present invention provides variable and selectablefused leads of the inner terminals as required through the use of anumber of processes, such as fusing and half etching. These processesmay be used to customize a common non-leaded integrated circuit packageto the required configuration per the integrated circuit die. The fusedleads provide additional bonding sites for the integrated circuit die toconnect to ground. The additional bonding sites may potentially provideshorter bond length for the bond wires as well as alleviate congestionsto bond the integrated circuit die to the outer and inner terminal pads,potentially resulting in an improved manufacturing yield of thenon-leaded integrated circuit package system.

Another aspect is that the present invention provides variable andselectable extensions from the fused leads to the edges of the packageas required through the use of a number of processes, such as fusing andhalf etching. These processes may be used to customize a commonnon-leaded integrated circuit package to the required configuration perthe integrated circuit die. The extensions provide additional groundconnection sites for the printed circuit board to the integrated circuitdie.

Yet another aspect is that the present invention provides variable andselectable paddle interconnects from the fused leads to the die paddleas required through the use of a number of processes, such as fusing andhalf etching. These processes may be used to customize a commonnon-leaded integrated circuit package to the required configuration perthe integrated circuit die. The paddle interconnects provide additionalground connection sites for the printed circuit board to the integratedcircuit die.

Yet another aspect of the present invention is the fused leads,extensions, paddle interconnects not only provide additional bondingsites for the integrated circuit die, they also provide additionalconnection sites for the printed circuit board design. Groundconnections from the printed circuit board to the non-leaded integratedcircuit package system may be formed by connecting to the die paddle,any one of the fused leads, the paddle interconnects, the extensions,the terminal pads, or a combination thereof. This connection flexibilityprovides an additional degree of freedom to minimize congestion of theprinted circuit board, potentially resulting in an improvedmanufacturing yield, thermal dissipation, and electrical performance ofthe printed circuit board.

Yet another aspect of the present invention is that multiple groundplanes may be provided while minimizing the printed circuit boardcongestion. The die paddle, the fused leads, the paddle interconnects,and the extensions may be connected to a particular ground plane, suchas digital ground, of the printed circuit board. However, other groundplanes, such as analog ground, may be connected to the terminals, asrequired.

Thus, it has been discovered that the non-leaded integrated circuitpackage system method of the present invention furnishes important andheretofore unknown and unavailable solutions, capabilities, andfunctional aspects for increasing input and output density in systems.The resulting processes and configurations are straightforward,cost-effective, uncomplicated, highly versatile and effective, can beimplemented by adapting known technologies, and are thus readily suitedfor efficiently and economically manufacturing non-leaded integratedcircuit packaged devices.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations that fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

The invention claimed is:
 1. A non-leaded intergrated circuit packagesystem comprising: a die paddle of a lead frame; a dual row of terminalsincluding a set of outer terminal and a set of inner terminals, whereinthe set of outer terminals and the set of inner terminals have astaggered configuration; and wherein the set of inner terminalsincludes: first inner terminal; a second inner terminal, the secondinner terminal adjacent the first inner terminal; wherein the firstinner terminal and the second inner terminal are depopulated to form afirst fused lead; and wherein the first fused lead to be connected to afirst ground plane of a printed circuit board; and wherein the set ofouter terminals and the set of inner terminals to be connected to asecond ground plane of the printed circuit board, the second groundplane being different than the first ground plane.
 2. The system asclaimed in claim 1 further comprising an extension from the first fusedlead to an edge of the dual row of terminals and next to the set ofouter terminals.
 3. The system as claimed in claim 1 further comprising:an extension from the first fused lead to an edge of the dual row ofterminals and next to the set of outer terminals; and a paddleinterconnect between the first fused lead and the die paddle.
 4. Thesystem as claimed in claim 1 wherein the first fused lead is formedalong at least one of a first side and a third side of the lead frame;and wherein the set of inner terminals further includes: a third innerterminal; a fourth inner terminal, the fourth inner terminal adjacentthe third inner terminal; wherein the fourth inner terminal and thethird inner terminal are depopulated to form a second fused lead; andwherein the second fused lead is formed along at least one of a secondside and a fourth side of the lead frame.
 5. The system as claimed inclaim 1 further comprising an encapsulant for encapsulating the diepaddle, the first fused lead, the set of outer terminal, and the set ofinner terminals.
 6. The system as claimed in claim 1 wherein the firstfused lead can be configured as a ground shield for the at least one ofthe first inner terminal and the second inner terminal.